All Stories

  1. Manufacturing processes for fabrication of flip-chip micro-bumps used in microelectronic packaging: An overview

    Article • Journal of Micromanufacturing, December 2019, SAGE Publications

    MADHAV DATTA

  2. Influence of FSP on the microstructure, microhardness, intergranular corrosion susceptibility and wear resistance of AA5083 alloy

    Article • Tribology - Materials Surfaces & Interfaces, June 2018, Taylor & Francis

    Dr Padmanaban R, MADHAV DATTA