All Stories

  1. A comparison between the hydrodynamic characteristics of 3D-printed polymer and etched silicon microchannels

    Article • Microfluidics and Nanofluidics, March 2015, Springer Science + Business Media

    Dr Jeff Punch

  2. Review and extension of pressure drop models applied to Taylor flow regimes

    Article • International Journal of Multiphase Flow, January 2015, Elsevier

    Dr Jeff Punch

  3. Local Nusselt number enhancements in liquid–liquid Taylor flows

    Article • International Journal of Heat and Mass Transfer, January 2015, Elsevier

    Dr Jeff Punch

  4. Optimization of Coil Parameters for a Nonlinear Two Degree-of-Freedom (2DOF) Velocity-amplified Electromagnetic Vibrational Energy Harvester

    Article • January 2015, Scitepress

    Dr Jeff Punch

  5. A Multiple-Degree-of-Freedom Velocity-Amplified Vibrational Energy Harvester: Part A — Experimental Analysis

    Article • September 2014, ASME International

    Dr Jeff Punch

  6. A Multiple Degree-of-Freedom Velocity-Amplified Vibrational Energy Harvester: Part B — Modelling

    Article • September 2014, ASME International

    Dr Jeff Punch

  7. A Comparison of the Creep Behavior of Joint-Scale SAC105 and SAC305 Solder Alloys

    Article • IEEE Transactions on Components Packaging and Manufacturing Technology, March 2014, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Jeff Punch

  8. Film thickness measurements in liquid–liquid slug flow regimes

    Article • International Journal of Heat and Fluid Flow, December 2013, Elsevier

    Dr Jeff Punch

  9. An Investigation of the Pressure Drop Associated With Liquid-Liquid Slug Flows

    Article • June 2013, ASME International

    Dr Jeff Punch

  10. Constitutive Modeling of Joint-Scale SAC305 Solder Shear Samples

    Article • IEEE Transactions on Components Packaging and Manufacturing Technology, February 2013, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Jeff Punch

  11. Mechanical Characterisation of the NiTi Shape Memory Alloy for Microfluidic Valve Applications

    Article • MRS Proceedings, January 2013, Cambridge University Press

    Dr Jeff Punch

  12. From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and Its Impact on Cooling Infrastructure Energy Efficiency

    Article • Journal of Electronic Packaging, November 2012, ASME International

    Dr Jeff Punch

  13. From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating Efficiency 1

    Article • Journal of Electronic Packaging, October 2012, ASME International

    Dr Jeff Punch

  14. Surface finish effect on reliability of SAC 305 soldered chip resistors

    Article • Soldering & Surface Mount Technology, September 2012, Emerald

    Maurice Collins, Dr Jeff Punch

  15. Testing method for measuring corrosion resistance of surface mount chip resistors

    Article • Microelectronics Reliability, July 2012, Elsevier

    Dr Jeff Punch

  16. Creep behavior of joint-scale Sn1.0Ag0.5Cu solder shear samples

    Article • May 2012, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Jeff Punch

  17. The influence of solar shielding on the thermal behavior of outdoor communication equipment

    Article • May 2012, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Jeff Punch

  18. The thermal behavior of a flip-chip laser array within a Photonics Integrated Circuit (PIC)

    Article • May 2012, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Jeff Punch

  19. From chip to cooling tower data center modeling: Validation of a Multi-Scale Energy Management model

    Article • May 2012, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Jeff Punch

  20. Thermal challenges in Photonic Integrated Circuits

    Article • April 2012, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Jeff Punch

  21. A comparison of the creep behaviour of joint-scale SAC105 and SAC305 solder samples under shear conditions

    Article • April 2012, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Jeff Punch

  22. Phenomenological Study of the Effect of Microstructural Evolution on the Thermal Fatigue Resistance of Pb-Free Solder Joints

    Article • IEEE Transactions on Components Packaging and Manufacturing Technology, October 2011, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Jeff Punch

  23. Thermal Fatigue and Failure Analysis of SnAgCu Solder Alloys With Minor Pb Additions

    Article • IEEE Transactions on Components Packaging and Manufacturing Technology, October 2011, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Jeff Punch

  24. The Influence of Heat Spreading on the Thermal Control of Photonics Integrated Circuits

    Article • January 2011, ASME International

    Dr Jeff Punch

  25. On the Thermal Characteristics of Two-Phase, Liquid-Liquid, Non-Boiling Droplet Flow in Minichannels

    Article • January 2011, ASME International

    Dr Jeff Punch

  26. From Chip to Cooling Tower Data Center Modeling: Influence of Chip Temperature Control Philosophy

    Article • Journal of Electronic Packaging, January 2011, ASME International

    Dr Jeff Punch

  27. From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating Efficiency

    Article • January 2011, ASME International

    Dr Jeff Punch

  28. From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and its Impact on Cooling Infrastructure Energy Efficiency

    Article • January 2011, ASME International

    Dr Jeff Punch

  29. On the Need for Energy Efficiency Metrics That Span Integrated IT-Facility Infrastructures

    Article • January 2011, ASME International

    Dr Jeff Punch

  30. Influence of Experimental Uncertainty on Prediction of Holistic Multi-Scale Data Center Energy Efficiency

    Article • January 2011, ASME International

    Dr Jeff Punch

  31. From Chip to Cooling Tower Data Center Modeling: Influence of Server Inlet Temperature and Temperature Rise Across Cabinet

    Article • Journal of Electronic Packaging, January 2011, ASME International

    Dr Jeff Punch

  32. Energy scavenging for energy efficiency in networks and applications

    Article • Bell Labs Technical Journal, August 2010, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Jeff Punch

  33. From chip to cooling tower data center modeling: Part I Influence of server inlet temperature and temperature rise across cabinet

    Article • June 2010, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Jeff Punch

  34. Temperature distribution on an isoflux surface cooled by an impinging liquid jet with a 40° Wall Jet Swirl Generator

    Article • Journal of Visualization, April 2010, Springer Science + Business Media

    Dr Jeff Punch

  35. Shock Pulse Shaping in a Small-Form Factor Velocity Amplifier

    Article • Shock and Vibration, January 2010, Hindawi Publishing Corporation

    Dr Jeff Punch

  36. A reliability model for SAC solder covering isothermal mechanical cycling and thermal cycling conditions

    Article • Microelectronics Reliability, January 2010, Elsevier

    Dr Jeff Punch

  37. Heat Transfer From Novel Target Surface Structures to a 3×3 Array of Normally Impinging Water Jets

    Article • Journal of Thermal Science and Engineering Applications, January 2010, ASME International

    Dr Jeff Punch

  38. Pressure drop in two phase slug/bubble flows in mini scale capillaries

    Article • International Journal of Multiphase Flow, October 2009, Elsevier

    Dr Jeff Punch

  39. In Situ Optical Creep Observation of Joint-Scale Tin–Silver–Copper Solder Shear Samples

    Article • Journal of Electronic Materials, July 2009, Springer Science + Business Media

    Dr Jeff Punch

  40. The influence of the Pb-free solder alloy composition and processing parameters on thermal fatigue performance of a ceramic chip resistor

    Article • May 2009, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Jeff Punch

  41. In-situ observation of SAC305 degradation during isothermal mechanical cycling of joint-scale samples

    Article • April 2009, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Jeff Punch

  42. An Investigation of Capped Glass Frit Sealed MEMS Devices in Contemporary Accelerometers

    Article • January 2009, ASME International

    Dr Jeff Punch

  43. Life Prediction of SAC305 Interconnects Under Temperature Cycling Conditions Using an Arbitrary Loading Fatigue Model

    Article • January 2009, ASME International

    Dr Jeff Punch

  44. An Experimental Investigation of the Flow Fields Within Geometrically Similar Miniature-Scale Centrifugal Pumps

    Article • Journal of Fluids Engineering, January 2009, ASME International

    Dr Jeff Punch

  45. Heat Transfer From Novel Target Surface Structures to a Normally Impinging, Submerged and Confined Water Jet

    Article • Journal of Thermal Science and Engineering Applications, January 2009, ASME International

    Dr Jeff Punch

  46. In-Situ Optical Creep Observation and Constitutive Modelling of Joint-Scale SAC Solder Shear Samples

    Article • December 2008, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Jeff Punch

  47. Friction factor and heat transfer in multiple microchannels with uniform flow distribution

    Article • International Journal of Heat and Mass Transfer, August 2008, Elsevier

    Dr Jeff Punch

  48. A comprehensive shear-testing facility for joint-scale solder samples

    Article • April 2008, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Jeff Punch

  49. The failure mechanisms of micro-scale cantilevers in shock and vibration stimuli

    Article • April 2008, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Jeff Punch

  50. An Analysis of the Flow Fields Within Geometrically-Similar Miniature Scale Centrifugal Pumps

    Article • January 2008, ASME International

    Dr Jeff Punch

  51. Thermal Properties of Carbon Nanotube-Polymer Composites for Thermal Interface Material Applications

    Article • January 2007, ASME International

    Dr Jeff Punch

  52. An Experimental and Theoretical Investigation of the Pumping Performance of Geometrically Similar Flow Fields Within Miniature-Scale Centrifugal Pumps

    Article • January 2007, ASME International

    Dr Jeff Punch

  53. PIV Measurements of the Effects of Geometric Scale on Electronics Cooling Axial Fan Flow

    Article • January 2007, ASME International

    Dr Jeff Punch

  54. Piecewise analysis and modeling of circuit pack temperature cycling data

    Article • Bell Labs Technical Journal, November 2006, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Jeff Punch

  55. The Dynamics of a Small-Scale Portable Electronics Device Under Impact Stimuli

    Article • January 2006, ASME International

    Dr Jeff Punch

  56. The Response of a Miniature Scale Cantilever Beam to High-G Impact Stimuli

    Article • January 2006, ASME International

    Dr Jeff Punch

  57. Determination of the Anand Viscoplasticity Model Constants for SnAgCu

    Article • January 2005, ASME International

    Dr Jeff Punch

  58. SnAgCu Micro-Ball Grid Array (BGA) Solder Joint Evaluation Using a Torsion Mechanical Fatigue Test Method

    Article • January 2005, ASME International

    Dr Jeff Punch

  59. The Response of Portable Electronics to Transient Conditions of Temperature and Humidity

    Article • January 2005, ASME International

    Dr Jeff Punch

  60. Thermal Analysis of a Micro-Polymerase Chain Reaction Device

    Article • January 2004, ASME International

    Dr Jeff Punch

  61. Experimental and Numerical Evaluation of SnAgCu and SnPb Solders Using a MicroBGA Under Accelerated Temperature Cycling Conditions

    Article • January 2004, ASME International

    Dr Jeff Punch

  62. An Investigation of the Lead-Free Surface Mount Soldering Process: Solder Joint Evaluation and Process Optimisation

    Article • January 2004, ASME International

    Dr Jeff Punch

  63. Board Level Drop Tests Comparing Lead-Free and Eutectic Solder Interconnects on a BGA Package for Mobile ICT Applications

    Article • January 2004, ASME International

    Dr Jeff Punch

  64. A Board Level Study of an Array of Ball Grid Components—Aerodynamic and Thermal Measurements

    Article • Journal of Electronic Packaging, January 2003, ASME International

    Dr Jeff Punch

  65. Analysis of Experimental Shock and Impact Response Data of a Printed Wire Board

    Article • January 2003, ASME International

    Dr Jeff Punch

  66. Forced Convection Board Level Thermal Design Methodology for Electronic Systems

    Article • Journal of Electronic Packaging, January 2001, ASME International

    Dr Jeff Punch