All Stories

  1. Boundary element analysis of three-dimensional thermomechanical orthotropic frictional contact problems
  2. Thermomechanical Optimization of Three-Dimensional Low Heat Generation Microelectronic Packaging Using the Boundary Element Method
  3. 3D thermoelastic solids under non‐linear interface thermal and orthotropic frictional contact conditions
  4. A Framework for the Optimization of Complex Cyber-Physical Systems via Directed Acyclic Graph
  5. Non-linear interface thermal conditions in three-dimensional thermoelastic contact problems
  6. A boundary element procedure to analyze the thermomechanical contact problem in 3D microelectronic packaging
  7. Thermoelastic influence of convective and conduction interstitial conditions on the size of the contact zone in three-dimensional receding thermoelastic contact problem
  8. The effect of conduction and convective conditions at interstitial regions on 3D thermoelastic contact problems
  9. An incremental-iterative BEM methodology to solve 3D thermoelastic contact problem including variable thermal resistance in the contact zone
  10. Improving security on networks with ancillary points