All Stories

  1. Investigation of coolant-dependent thermal performance in backside-embedded micro-pin fin arrays for high-power microelectronics cooling

    Article • International Journal of Thermal Sciences, February 2026, Elsevier

    Associate Professor Huicheng Feng

  2. Development of an Embedded 2-Phase Cooling Solution for Two Stacked High-Power Chips in Future HPC HPC and AI Applications

    Article • May 2025, Institute of Electrical & Electronics Engineers (IEEE)

    Associate Professor Huicheng Feng

  3. Thermal Characterization of HBMs Integrated via Hybrid Bonding

    Article • May 2025, Institute of Electrical & Electronics Engineers (IEEE)

    Associate Professor Huicheng Feng

  4. Thermal Management of Nano-TSVS in Advanced BS-PDN: A Comparative Study of AlN and Oxide Dielectrics for Heat Dissipation Efficiency

    Article • May 2025, Institute of Electrical & Electronics Engineers (IEEE)

    Associate Professor Huicheng Feng

  5. A theoretical model for mass transition rate at liquid-vapor sharp interface

    Article • International Communications in Heat and Mass Transfer, February 2025, Elsevier

    Associate Professor Huicheng Feng

  6. Two-phase Liquid Cooling of Vertically Stacked High-Power Chips with Backside-Embedded Micro-Pin Fins

    Article • IEEE Transactions on Components Packaging and Manufacturing Technology, January 2025, Institute of Electrical & Electronics Engineers (IEEE)

    Associate Professor Huicheng Feng

  7. Embedded Backside Cooling Solution for Two Stacked High-Power Chips

    Article • December 2024, Institute of Electrical & Electronics Engineers (IEEE)

    Associate Professor Huicheng Feng

  8. Thermal Design and Analysis of a Flip-Chip GaN-on-SiC HEMT

    Article • December 2024, Institute of Electrical & Electronics Engineers (IEEE)

    Associate Professor Huicheng Feng

  9. Wafer Level Fabrication of Embedded Liquid Cooling Solutions on Heating Devices with TSV Interconnects

    Article • December 2024, Institute of Electrical & Electronics Engineers (IEEE)

    Associate Professor Huicheng Feng

  10. Embedded Liquid Cooling of High-Power Microelectronics Using Liquid Metal

    Article • May 2024, Institute of Electrical & Electronics Engineers (IEEE)

    Associate Professor Huicheng Feng

  11. Comparative study of double-sided spray cooling system under atmospheric and sub-atmospheric ambient pressures

    Article • Thermal Science and Engineering Progress, March 2024, Elsevier

    Associate Professor Huicheng Feng

  12. Two-Phase Liquid Cooling for High-Power Microelectronics via Embedded Micro-Pin Fin Heat Sink

    Article • IEEE Transactions on Components Packaging and Manufacturing Technology, March 2024, Institute of Electrical & Electronics Engineers (IEEE)

    Associate Professor Huicheng Feng

  13. Development of Crossflow Manifold for Two-Phase Liquid Cooling of 3D ICs via 3D Printing

    Article • December 2023, Institute of Electrical & Electronics Engineers (IEEE)

    Associate Professor Huicheng Feng

  14. Wafer Level Fabrication of Embedded Silicon Microcooler on Heating Devices

    Article • December 2023, Institute of Electrical & Electronics Engineers (IEEE)

    Associate Professor Huicheng Feng

  15. Flexible Strain Sensor-Based Data Glove for Gesture Interaction in the Metaverse: A Review

    Article • International Journal of Human-Computer Interaction, May 2023, Taylor & Francis

    Associate Professor Huicheng Feng

  16. Development and Demonstration of a Novel Immersion Two Phase Cooling High Power SiC Power Module

    Article • May 2023, Institute of Electrical & Electronics Engineers (IEEE)

    Associate Professor Huicheng Feng

  17. Embedded Micro-Pin Fin Heat Sink of Two-Phase Liquid Cooling for High Heat Flux 3D ICs

    Article • May 2023, Institute of Electrical & Electronics Engineers (IEEE)

    Associate Professor Huicheng Feng

  18. Slow development of induced-charge electro-osmosis in cetyltrimethylammonium bromide solutions

    Article • Colloids and Surfaces A Physicochemical and Engineering Aspects, May 2023, Elsevier

    Associate Professor Huicheng Feng

  19. Design and Development of Manifolds for Parallel Flow and Counter Flow in Two-Phase Cooling of 3D ICs

    Article • December 2022, Institute of Electrical & Electronics Engineers (IEEE)

    Associate Professor Huicheng Feng

  20. Numerical Simulation for Flow Boiling in Microchannels with Different Pin Fin Arrays

    Article • December 2022, Institute of Electrical & Electronics Engineers (IEEE)

    Associate Professor Huicheng Feng

  21. A Simple 3-D Microelectrode Fabrication Process and Its Application in Microfluidic Impedance Cytometry

    Article • IEEE Sensors Journal, November 2022, Institute of Electrical & Electronics Engineers (IEEE)

    Associate Professor Huicheng Feng

  22. Performance evaluation of a 3D split-and-recombination micromixer with asymmetric structures

    Article • Journal of Micromechanics and Microengineering, June 2022, Institute of Physics Publishing

    Associate Professor Huicheng Feng

  23. Enhancing signals of microfluidic impedance cytometry through optimization of microelectrode array

    Article • Electrophoresis, April 2022, Wiley

    Associate Professor Huicheng Feng

  24. Recent advances in wireless epicortical and intracortical neuronal recording systems

    Article • Science China Information Sciences, March 2022, Springer Science + Business Media

    Associate Professor Huicheng Feng

  25. Experimental investigation of chaotic induced-charge electro-osmosis

    Article • Physics of Fluids, January 2022, American Institute of Physics

    Associate Professor Huicheng Feng

  26. Two-dimensional colloidal particle assembly in ionic surfactant solutions under an oscillatory electric field

    Article • Journal of Physics D Applied Physics, September 2021, Institute of Physics Publishing

    Associate Professor Huicheng Feng

  27. Non-monotonic dependence of induced-charge electro-osmosis on ion concentration

    Article • Colloids and Surfaces A Physicochemical and Engineering Aspects, August 2021, Elsevier

    Associate Professor Huicheng Feng

  28. Comparative study on the enhancement of spray cooling heat transfer using conventional and bio-surfactants

    Article • Applied Thermal Engineering, July 2021, Elsevier

    Associate Professor Huicheng Feng

  29. Reliable Connection Between Stretchable Electrodes on PDMS and Flexible Flat Cable by Introducing Thermal Release Tape

    Article • June 2021, Institute of Electrical & Electronics Engineers (IEEE)

    Associate Professor Huicheng Feng

  30. Recent advances in paper‐based preconcentrators by utilizing ion concentration polarization

    Article • Electrophoresis, April 2021, Wiley

    Associate Professor Huicheng Feng

  31. Implantable Thin Film Devices as Brain-Computer Interfaces: Recent Advances in Design and Fabrication Approaches

    Article • Coatings, February 2021, MDPI AG

    Associate Professor Huicheng Feng

  32. Thermal Strain-Induced Self-Rolling Mesh Cuff Electrodes for Non-Linear Peripheral Nerve

    Article • January 2021, Institute of Electrical & Electronics Engineers (IEEE)

    Associate Professor Huicheng Feng

  33. Unique dynamics of water-ethanol binary droplets impacting onto a superheated surface with nanotubes

    Article • International Journal of Heat and Mass Transfer, January 2021, Elsevier

    Associate Professor Huicheng Feng

  34. Recent advancement in induced-charge electrokinetic phenomena and their micro- and nano-fluidic applications

    Article • Advances in Colloid and Interface Science, June 2020, Elsevier

    Associate Professor Huicheng Feng

  35. Influence of air on heat transfer of a closed-loop spray cooling system

    Article • Experimental Thermal and Fluid Science, February 2020, Elsevier

    Associate Professor Huicheng Feng

  36. Net fluid flow and non-Newtonian effect in induced-charge electro-osmosis of polyelectrolyte solutions

    Article • July 2019, American Physical Society (APS)

    Associate Professor Huicheng Feng

  37. Low-Melting Alloy Microfluidic Electrode Based on Hydrophobic Valve and its Application in Coulter Counter

    Article • June 2019, Institute of Electrical & Electronics Engineers (IEEE)

    Associate Professor Huicheng Feng

  38. Numerical Investigation on the Condensation Heat Transfer of FC72 in the Presence of Air

    Article • December 2018, Institute of Electrical & Electronics Engineers (IEEE)

    Associate Professor Huicheng Feng

  39. Spray cooling enhancement studies using dielectric liquid

    Article • December 2018, Institute of Electrical & Electronics Engineers (IEEE)

    Associate Professor Huicheng Feng

  40. Induced-charge electro-osmosis in dielectric annuli

    Article • Applied Mathematics and Computation, September 2018, Elsevier

    Associate Professor Huicheng Feng

  41. Electrophoresis of a Cylinder in a Cylindrical Tube

    Article • Communications in Computational Physics, July 2017, Global Science Press

    Associate Professor Huicheng Feng

  42. Octagon to Square Wetting Area Transition of Water–Ethanol Droplets on a Micropyramid Substrate by Increasing Ethanol Concentration

    Article • Langmuir, January 2017, American Chemical Society (ACS)

    Associate Professor Huicheng Feng

  43. Electrolyte effect in induced charge electroosmosis

    Article • Soft Matter, January 2017, Royal Society of Chemistry

    Associate Professor Huicheng Feng

  44. Induced charge electrophoresis of a conducting cylinder in a nonconducting cylindrical pore and its micromotoring application

    Article • Physical Review Fluids, August 2016, American Physical Society (APS)

    Associate Professor Huicheng Feng

  45. Chaotic micromixer utilizing electro-osmosis and induced charge electro-osmosis in eccentric annulus

    Article • Physics of Fluids, June 2016, American Institute of Physics

    Associate Professor Huicheng Feng

  46. Pair interactions between conducting and non-conducting cylinders under uniform electric field

    Article • Chemical Engineering Science, March 2016, Elsevier

    Associate Professor Huicheng Feng

  47. Pair interactions in induced charge electrophoresis of conducting cylinders

    Article • International Journal of Heat and Mass Transfer, September 2015, Elsevier

    Associate Professor Huicheng Feng