All Stories

  1. Simulation-based laser process development for industrial laser micromachining applications

    Article • March 2025, SPIE

    Hisashi Matsumoto

  2. Rapid and high throughput formation of through glass vias

    Article • March 2024, SPIE

    Hisashi Matsumoto

  3. Rapid and complex dynamics of through glass via formation using a picosecond quasi-continuous wave laser as revealed by time-resolved absorptance measurements and multiphase modeling

    Article • Applied Physics A, March 2023, Springer Science + Business Media

    Hisashi Matsumoto

  4. Analysis and mitigation of stress induced by rapid formation of through glass vias in thin substrates

    Article • March 2023, SPIE

    Hisashi Matsumoto

  5. Rapid formation of high aspect ratio through holes in thin glass substrates using an engineered, QCW laser approach

    Article • Applied Physics A, March 2022, Springer Science + Business Media

    Hisashi Matsumoto

  6. Ultrafast laser ablation of silicon with ∼GHz bursts

    Article • Journal of Laser Applications, August 2021, Laser Institute of America

    Hisashi Matsumoto

  7. Ultrafast laser ablation of copper with ~GHz bursts

    Article • February 2018, SPIE

    Hisashi Matsumoto