All Stories

  1. Modified Stoney formula for determining stress within thin films on large-deformation isotropic circular plates

    Article • AIP Advances, December 2021, American Institute of Physics

    Dr. Haijun Liu

  2. Obtainment of Residual Stress Distribution from Surface Deformation under Continuity Constraints for Thinned Silicon Wafers

    Article • Machines, November 2021, MDPI AG

    Dr. Haijun Liu

  3. Precision force control of an underactuated stance leg exoskeleton for human performance augmentation

    Article • Proceedings of the Institution of Mechanical Engineers Part I Journal of Systems and Control Engineering, August 2021, SAGE Publications

    Dr. Haijun Liu

  4. Evaluation of polishing-induced subsurface damage based on residual stress distribution via measured global surface deformation for thinned silicon wafers

    Article • Surface Topography Metrology and Properties, July 2021, Institute of Physics Publishing

    Dr. Haijun Liu

  5. FEM-based optimization approach to machining strategy for thin-walled parts made of hard and brittle materials

    Article • The International Journal of Advanced Manufacturing Technology, August 2020, Springer Science + Business Media

    Dr. Haijun Liu

  6. Machine tool movement control method combining the benefit of software and real-time interpolator for sculpture surface machining

    Article • Proceedings of the Institution of Mechanical Engineers Part B Journal of Engineering Manufacture, April 2020, SAGE Publications

    Dr. Haijun Liu

  7. Accurate determination of bifurcation points for ground silicon wafers considering anisotropy using FEM method

    Article • Materials Research Express, July 2019, Institute of Physics Publishing

    Dr. Haijun Liu

  8. An empirical equation for prediction of silicon wafer deformation

    Article • Materials Research Express, June 2017, Institute of Physics Publishing

    Dr. Haijun Liu

  9. Three-point-support method based on position determination of supports and wafers to eliminate gravity-induced deflection of wafers

    Article • Precision Engineering, October 2016, Elsevier

    Dr. Haijun Liu

  10. A new method for measuring the flatness of large and thin silicon substrates using a liquid immersion technique

    Article • Measurement Science and Technology, October 2015, Institute of Physics Publishing

    Dr. Haijun Liu

  11. Analysis Of Factors Affecting Gravity-Induced Deflection For Large And Thin Wafers In Flatness Measurement Using Three-Point-Support Method

    Article • January 2015, De Gruyter

    Dr Shang Gao, Dr. Haijun Liu