All Stories

  1. Accelerated mechanical fatigue interconnect testing method for electrical wire bonds
  2. Fatigue life time modelling of Cu and Au fine wires
  3. Erratum to: Fatigue life time modelling of Cu and Au fine wires
  4. Influence of Defects on High Cycle Fatigue Response of Ti45Nb Biocompatible Alloy
  5. On the Influence of Internal Void Size on the Fracture Stress of Constrained Solder Joints
  6. Cyclic Deformation Behaviour of Cu Multilayered Films on Si Substrates
  7. Cross-sectional nanoindentation (CSN) studies on the effect of thickness on adhesion strength of thin films