All Stories

  1. Hot Deformation Behavior and Microstructural Evolution of Wire-Arc Additively Fabricated Inconel 718 Superalloy
  2. Microstructural characterization and oxidation performance of solution-annealed and precipitation hardened wire-arc additively manufactured Inconel 718 superalloys
  3. Application of Wire Arc Additive Manufacturing for Inconel 718 Superalloy
  4. High-temperature oxidation performance of wire-arc additively manufactured Inconel 718 superalloys
  5. In-Situ Fabrication of Titanium Iron Intermetallic Compound by the Wire Arc Additive Manufacturing Process
  6. An overview on TiFe intermetallic for solid-state hydrogen storage
  7. Characteristics and Selection of Materials Used in Microelectromechanical Systems (MEMS) ☆
  8. Electronic Devices Based on Group III Nitrides ☆
  9. Electronic Packaging: Conductive Adhesives ☆
  10. Semiconductor Heterojunctions ☆
  11. Interfacial reaction, ball shear strength and fracture surface analysis of lead-free solder joints prepared using cobalt nanoparticle doped flux
  12. Superconducting Permanent Magnets: Potential Applications ☆
  13. Alloys of 4f (R) and 3d (T) Elements: Magnetism
  14. Amorphous Silicon and Germanium
  15. Amorphous and Glassy Semiconducting Chalcogenides
  16. Ballistic Transport in 1D GaAs/AlGaAs Heterostructures
  17. Bi2TeO5: Growth and Properties
  18. Electrical and Electronic Connectors: Materials and Technology
  19. Formation of Ultra-Shallow Junctions
  20. GaN-Based Transistors for High-Frequency Applications
  21. Indium–Arsenic–Antimony Materials and Devices
  22. Interconnects
  23. Low-Loss Ceramics in Mobile Communications
  24. Magnetic Materials: Hard
  25. Magneto-Optic Recording Materials: Chemical Stability and Life Time
  26. Magnets: High-temperature
  27. Microelectronic Packaging: Electrical Interconnections
  28. Organic Conductors and Semiconductors, Optical Properties of
  29. Organic Conductors and Semiconductors, Structure and Morphology of
  30. Silicon Carbide Electronic Devices
  31. Steels, Silicon Iron-Based: Magnetic Properties
  32. Superconducting Microwave Applications: Filters
  33. Superconducting Wires and Cables: High-Field Applications
  34. Thin Films: Giant Magnetostrictive
  35. Ball shear strength and fracture modes of lead-free solder joints prepared using nickel nanoparticle doped flux
  36. Ball shear strength and fracture mode of lead-free solder joints prepared using nickel nanoparticle doped flux
  37. Effects of metallic nanoparticle doped flux on the interfacial intermetallic compounds between lead-free solder ball and copper substrate
  38. Effects of metallic nanoparticle doped flux on interfacial intermetallic compounds between Sn-3.0Ag-0.5Cu and copper substrate