All Stories

  1. Microstructural characterization and oxidation performance of solution-annealed and precipitation hardened wire-arc additively manufactured Inconel 718 superalloys
  2. High-temperature oxidation performance of wire-arc additively manufactured Inconel 718 superalloys
  3. In-Situ Fabrication of Titanium Iron Intermetallic Compound by the Wire Arc Additive Manufacturing Process
  4. An overview on TiFe intermetallic for solid-state hydrogen storage
  5. Characteristics and Selection of Materials Used in Microelectromechanical Systems (MEMS) ☆
  6. Electronic Devices Based on Group III Nitrides ☆
  7. Electronic Packaging: Conductive Adhesives ☆
  8. Semiconductor Heterojunctions ☆
  9. Interfacial reaction, ball shear strength and fracture surface analysis of lead-free solder joints prepared using cobalt nanoparticle doped flux
  10. Superconducting Permanent Magnets: Potential Applications ☆
  11. Alloys of 4f (R) and 3d (T) Elements: Magnetism
  12. Amorphous Silicon and Germanium
  13. Amorphous and Glassy Semiconducting Chalcogenides
  14. Ballistic Transport in 1D GaAs/AlGaAs Heterostructures
  15. Bi2TeO5: Growth and Properties
  16. Electrical and Electronic Connectors: Materials and Technology
  17. Formation of Ultra-Shallow Junctions
  18. GaN-Based Transistors for High-Frequency Applications
  19. Indium–Arsenic–Antimony Materials and Devices
  20. Interconnects
  21. Low-Loss Ceramics in Mobile Communications
  22. Magnetic Materials: Hard
  23. Magneto-Optic Recording Materials: Chemical Stability and Life Time
  24. Magnets: High-temperature
  25. Microelectronic Packaging: Electrical Interconnections
  26. Organic Conductors and Semiconductors, Optical Properties of
  27. Organic Conductors and Semiconductors, Structure and Morphology of
  28. Silicon Carbide Electronic Devices
  29. Steels, Silicon Iron-Based: Magnetic Properties
  30. Superconducting Microwave Applications: Filters
  31. Superconducting Wires and Cables: High-Field Applications
  32. Thin Films: Giant Magnetostrictive
  33. Ball shear strength and fracture modes of lead-free solder joints prepared using nickel nanoparticle doped flux
  34. Ball shear strength and fracture mode of lead-free solder joints prepared using nickel nanoparticle doped flux
  35. Effects of metallic nanoparticle doped flux on the interfacial intermetallic compounds between lead-free solder ball and copper substrate
  36. Effects of metallic nanoparticle doped flux on interfacial intermetallic compounds between Sn-3.0Ag-0.5Cu and copper substrate