All Stories

  1. Wettability, Interfacial Behavior and Joint Properties of Sn-15Bi Solder

    Article • Journal of Electronic Materials, July 2019, Springer Science + Business Media

    fengjiang wang

  2. Comprehensive Properties of a Novel Quaternary Sn-Bi-Sb-Ag Solder: Wettability, Interfacial Structure and Mechanical Properties

    Article • Metals, July 2019, MDPI AG

    fengjiang wang

  3. Recent progress on the development of Sn–Bi based low-temperature Pb-free solders

    Article • Journal of Materials Science Materials in Electronics, January 2019, Springer Science + Business Media

    fengjiang wang

  4. Atomic migration on Cu in Sn-58Bi solder from the interaction between electromigration and thermomigration

    Article • Materials Research Express, January 2019, Institute of Physics Publishing

    fengjiang wang

  5. Interfacial Behaviors in Cu/Molten Sn–58Bi/Cu Solder Joints Under Coupling with Thermal and Current Stressing

    Article • Electronic Materials Letters, November 2018, Springer Science + Business Media

    fengjiang wang

  6. Electromigration behaviors in Sn–58Bi solder joints under different current densities and temperatures

    Article • Journal of Materials Science Materials in Electronics, October 2018, Springer Science + Business Media

    fengjiang wang

  7. Interfacial behavior and joint strength of Sn–Bi solder with solid solution compositions

    Article • Journal of Materials Science Materials in Electronics, May 2018, Springer Science + Business Media

    Prof. Chao Yan, fengjiang wang

  8. Interfacial evolution in Sn–58Bi solder joints during liquid electromigration

    Article • Journal of Materials Science Materials in Electronics, March 2018, Springer Science + Business Media

    fengjiang wang

  9. Improvement on interfacial structure and properties of Sn–58Bi/Cu joint using Sn–3.0Ag–0.5Cu solder as barrier

    Article • Journal of Materials Science Materials in Electronics, September 2017, Springer Science + Business Media

    Prof. Chao Yan, fengjiang wang

  10. Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints

    Article • Materials, August 2017, MDPI AG

    Prof. Chao Yan, fengjiang wang

  11. Effect of Sn-Ag-Cu on the Improvement of Electromigration Behavior in Sn-58Bi Solder Joint

    Article • Journal of Electronic Materials, June 2017, Springer Science + Business Media

    fengjiang wang

  12. Interfacial behaviors of Sn-Pb, Sn-Ag-Cu Pb-free and mixed Sn-Ag-Cu/Sn-Pb solder joints during electromigration

    Article • Microelectronics Reliability, June 2017, Elsevier

    Prof. Chao Yan, fengjiang wang

  13. Microstructural Evolution of Sn-58Bi/Cu Joints through Minor Zn Alloying Substrate during Electromigration

    Article • MATERIALS TRANSACTIONS, January 2017, Japan Institute of Metals

    fengjiang wang

  14. Microstructural evolution and joint strength of Sn-58Bi/Cu joints through minor Zn alloying substrate during isothermal aging

    Article • Journal of Alloys and Compounds, December 2016, Elsevier

    fengjiang wang

  15. Comparative study on the wettability and interfacial structure in Sn–xZn/Cu and Sn/Cu–xZn system

    Article • Journal of Materials Science Materials in Electronics, September 2016, Springer Science + Business Media

    fengjiang wang

  16. Rapid microstructure evolution of structural composite solder joints induced by low-density current stressing

    Article • Materials Letters, June 2016, Elsevier

    fengjiang wang

  17. Mechanical properties of SnBi-SnAgCu composition mixed solder joints using bending test

    Article • Materials Science and Engineering A, June 2016, Elsevier

    fengjiang wang

  18. Microstructural evolution and tensile properties of Sn–Ag–Cu mixed with Sn–Pb solder alloys

    Article • Journal of Alloys and Compounds, May 2009, Elsevier

    fengjiang wang

  19. Development of Cu–Sn intermetallic compound at Pb-free solder/Cu joint interface

    Article • Materials Letters, July 2003, Elsevier

    fengjiang wang