All Stories

  1. Fundamental understanding of the development process for metal oxide photoresists

    Article • April 2025, SPIE

    CONG QUE DINH

  2. Tight-pitch contact-hole patterns in EUV lithography

    Article • April 2025, SPIE

    CONG QUE DINH

  3. Application of new development technology to ultra-narrow pitch patterns formed by electron beam lithography

    Article • April 2025, SPIE

    CONG QUE DINH

  4. Coater/developer-based patterning techniques to improve tight pitches towards high-NA EUV

    Article • April 2024, SPIE

    CONG QUE DINH

  5. Latest advances in EUV patterning for preparation of high numerical aperture EUV

    Article • April 2024, SPIE

    CONG QUE DINH

  6. Advanced processes in metal-oxide resists for high-NA EUV lithography

    Article • April 2024, SPIE

    CONG QUE DINH

  7. Roughness improvement by post-development treatment of CAR for high-NA EUV lithography

    Article • April 2024, SPIE

    CONG QUE DINH

  8. Coater/developer-based patterning techniques to achieve tight pitches with 0.33 NA single exposure

    Article • November 2023, SPIE

    CONG QUE DINH

  9. Holistic litho-etch approach towards high NA EUV challenges

    Article • November 2023, SPIE

    CONG QUE DINH

  10. Advanced development for contact-holes of metal-oxide resists

    Article • November 2023, SPIE

    CONG QUE DINH

  11. Advanced development methods for high-NA EUV lithography

    Article • May 2023, SPIE

    CONG QUE DINH

  12. Establishment of new process technology for EUV lithography

    Article • May 2023, SPIE

    CONG QUE DINH

  13. Recent advances in EUV patterning in preparation towards high-NA EUV

    Article • May 2023, SPIE

    CONG QUE DINH

  14. Coater/developer-based techniques to improve high-resolution EUV patterning

    Article • October 2022, SPIE

    CONG QUE DINH

  15. Outlook for high-NA EUV patterning: a holistic patterning approach to address upcoming challenges

    Article • May 2022, SPIE

    CONG QUE DINH

  16. Approaches to enable patterning of tight pitches towards high NA EUV

    Article • May 2022, SPIE

    CONG QUE DINH

  17. Addressing EUV patterning challenges towards the limits of NA 0.33 EUV exposure

    Article • September 2021, SPIE

    CONG QUE DINH

  18. EUV resist performance enhancement by UV flood exposure for high NA EUV lithography

    Article • February 2021, SPIE

    CONG QUE DINH

  19. EUV resist chemical gradient enhancement by UV flood exposure for improvement in EUV resist resolution, process control, roughness, sensitivity and stochastic defectivity

    Article • March 2020, SPIE

    CONG QUE DINH

  20. PSCAR optimization to reduce EUV resist roughness with sensitization using Resist Formulation Optimizer (RFO) (Conference Presentation)

    Article • April 2019, SPIE

    CONG QUE DINH

  21. Calibrated PSCAR stochastic simulation

    Article • March 2019, SPIE

    CONG QUE DINH

  22. High-resist sensitization by pattern and flood combination lithography

    Article • April 2014, SPIE

    CONG QUE DINH

  23. Relation between sensitivity and resolution in polymer bound PAGs and polymer blend PAGs

    Article • April 2013, SPIE

    CONG QUE DINH