All Stories

  1. Low-loss 800nm-thick PECVD silicon nitride photonic platform on 300-mm wafer

    Article • March 2024, SPIE

    Chin Khang Tew

  2. Investigation of Immersion AM Signal and Alignment Success Rate for Flat Optics with Aperture

    Article • December 2023, Institute of Electrical & Electronics Engineers (IEEE)

    Chin Khang Tew

  3. A Precise Wafer Thinning Integration Process for nano-TSV Formation

    Article • May 2023, Institute of Electrical & Electronics Engineers (IEEE)

    Chin Khang Tew

  4. Alignment through thick Si layer on bonded wafers using immersion lithography.

    Article • May 2023, Institute of Electrical & Electronics Engineers (IEEE)

    Chin Khang Tew

  5. LER Optimization of Photonics Components in Electronics Photonics Heterogeneous Integration

    Article • December 2022, Institute of Electrical & Electronics Engineers (IEEE)

    Chin Khang Tew