All Stories

  1. Beyond UV: Near-infrared light enabled vat photopolymerization for direct 3D printing of dense SiC ceramics
  2. Enhanced shape memory and superelasticity in small-volume ceramics: a perspective on the controlling factors
  3. Characterization of the Young’s modulus, residual stress and fracture strength of Cu–Sn–In thin films using combinatorial deposition and micro-cantilevers
  4. Study of charge distribution and charge loss in dual-layer metal-nanocrystal-embedded high-κ/SiO2 gate stack
  5. Stress migration risk on electromigration reliability in advanced narrow line copper interconnects
  6. Void dynamics in copper-based interconnects
  7. Defect-induced ferromagnetism on pulsed laser ablated Zn0.95Co0.05O diluted magnetic semiconducting thin films
  8. The effect of stress migration on electromigration in dual damascene copper interconnects