All Stories

  1. Image segmentation on void regional formation in the flip-chip underfilling process by comparing YOLO and mask RCNN

    Article • Soldering & Surface Mount Technology, October 2024, Emerald

    Calvin Ling

  2. Using A.I. to explain why defects happen in a certain area.

    Article • Soldering & Surface Mount Technology, October 2023, Emerald

    Calvin Ling

  3. The Comparison of Medical Grade PP with Common Grade PP in Injection Moulding Process

    Article • CFD letters, May 2022, Akademia Baru Publishing

    Calvin Ling