All Stories

  1. Model-Based Frequency Adaptive Microwave Heating for PCR Applications
  2. One-port CSRR Structure for Dielectric Characterization of Lossy Materials
  3. Tapered CPW Transmission Line for Enlarging Dynamic Range of Transmission Spectroscopy
  4. CSRR-based Low Power Microwave Heater for PCR Applications
  5. Analysis of Microwave Heating Devices for Microfluidics
  6. Microwave determination of liquid mixing ratio for microfluidics
  7. A General Line–Line Method for Dielectric Material Characterization Using Conductors With the Same Cross-Sectional Geometry
  8. A Planar One-Port Microwave Microfluidic Sensor for Microliter Liquids Characterization
  9. A Multiline Multimaterial Calibration Method for Liquid Characterization
  10. Millimeter wave planar transition from plastic rectangular waveguide to 1 mm coax
  11. Radiation of input decoupling network typically used in switching DC-DC converters
  12. Circuit modelling of printed circuit boards for a DC-DC converter design
  13. Simple and Scalable Methodology for Equivalent Circuit Modeling of IC Packages
  14. Efficient Dithering Technique With Periodic Waveforms for RF Test and Characterization
  15. EuMW Special Issue
  16. A smart wearable textile array system for biomedical telemetry applications
  17. Optimization of an RFID loop antenna with smart goal functions
  18. A system-level simulator for indoor mmW SAR imaging and its applications
  19. Characterizing the TEM Cell Electric and Magnetic Field Coupling to PCB Transmission Lines
  20. Welcome messages: Welcome to the 42nd EuMC
  21. Waveforms-based large-signal identification of transistor models
  22. Nonlinear deembedding of microwave large-signal measurements
  23. A novel indoor localization system for healthcare environments
  24. Octave-bandwidth band-pass filter with high selectivity and wide highly-suppressed stopband
  25. Possible improvements of exisiting indoor MMW focal plane imaging systems
  26. Waveforms-Only Based Nonlinear De-Embedding in Active Devices
  27. Slot coupled patch antenna in MCM-D for millimeter wave detector matrix applications
  28. Mutual Coupling Reduction Between Planar Antennas by Using a Simple Microstrip U-Section
  29. Fully micromachined W-band rectangular waveguide to grounded coplanar waveguide transition
  30. 60 GHz low noise amplifiers with 1 kV CDM protection in 40 nm LP CMOS
  31. Influence of antenna's directivity in indoor mmW/THz SAR imaging systems: A system level simulation-based study
  32. Design and reliability evaluation of passive HF RFID systems in metal environments
  33. Analysis of the Realistic Resolution with Angle of Arrival for Indoor Positioning
  34. Circuits and systems engineering education through interdisciplinary team-based design projects
  35. A low-cost linear upconverter to extend frequency range of vector signal generator
  36. Waveguide tuner stabilized ultra low phase noise 60 GHz SiGe:C oscillator MMIC
  37. Identification technique of FET model based on vector nonlinear measurements
  38. A de-embedding procedure oriented to the determination of FET intrinsic I-V characteristics from high-frequency large-signal measurements
  39. Vector two-tone measurements for validation of non-linear microwave FinFET model
  40. Impact of sampling domain and number of samples on the accuracy of large-signal multisine measurement-based behavioral model
  41. A wideband beamformer for a phased-array 60GHz receiver in 40nm digital CMOS
  42. Time of Arrival Based on Chirp Pulses as a means to Perform Localization in IEEE 802.15.4a Wireless Sensor Networks
  43. Simple and accurate approaches to implement the complex trans-conductance suited for time-domain simulators for small-signal and large-signal table-based models
  44. Experimental investigation of LF dispersion and IMD asymmetry within GaN based HEMT technology
  45. Evaluation of lookup-table non-quasi-static nonlinear models at microwave and mm-wave frequencies
  46. Millimeter wave imaging system modeling: spatial frequency domain calculation versus spatial domain calculation
  47. Technology-Independent Non-Quasi-Static Table-Based Nonlinear Model Generation
  48. Low-Cost CMOS-Based Receive Modules for 60 GHz Wireless Communication
  49. Millimeter wave micromachined cavity resonators on MCM-D: Oscillator-resonator co-design and packaging considerations
  50. Detailed analysis of parasitic loading effects on power performance of GaN-on-silicon HEMTs
  51. 50-to-67GHz ESD-protected power amplifiers in digital 45nm LP CMOS
  52. Influence of Different Types of Metal Plates on a High Frequency RFID Loop Antenna: Study and Design
  53. Three-stage Doherty amplifier for WiMAX application
  54. Simultaneous measurement of high and low frequency response of non-linear microwave circuits
  55. Inexpensive solution to double RF bandwidth of vector signal generator
  56. Horizontal Integration of Cavity Filters on High-Resistivity Silicon Thin-Film Technology
  57. WiMAX class AB and class E power amplifier design using equivalent capacitance concept
  58. Wide-band hybrid power amplifier design using GaN FETs
  59. Non-quasi-static nonlinear model for FinFETs using higher-order sources
  60. Complete characterisation of LF and RF dynamics at device terminals within microwave circuits
  61. Efficiency Enhancement of Harmonic-Tuned GaN Power Amplifier Using Doherty like Load Modulation
  62. Doherty amplifier design for 3.5 GHz WiMAX considering load line and loop stability
  63. 60 GHz ultra low phase noise sige common base oscillator using a wirebond coupled mcm integrated micromachined cavity resonator
  64. Black box modelling of the Op-Amp including switching power supply on effect
  65. Comparison of optical and millimeter wave imaging on speckle
  66. Thin-film MCM-D technology with through-substrate vias for the integration of 3D SiP modules
  67. RF Class-E Power Amplifier Design Based on a Load Line-Equivalent Capacitance Method
  68. Study of active millimeter-wave image speckle reduction by Hadamard phase pattern illumination
  69. Ultra-Miniaturized Integrated Cavities on High-Resistivity Silicon Thin-Film MCM-D Technology
  70. A Robust Semantic Overlay Network for Microgrid Control Applications
  71. System modelling for millimeter-wave imaging systems using a 2.5D calculation method
  72. Microstrip thin-film MCM-D technology on high-resistivity silicon with integrated through-substrate vias
  73. GaN power amplifier design based on artificial neural network modelling
  74. Analytical Model of the DC Actuation of Electrostatic MEMS Devices With Distributed Dielectric Charging and Nonplanar Electrodes
  75. An electrostatic fringing-field actuator (EFFA): application towards a low-complexity thin-film RF-MEMS technology
  76. Millimeter wave imaging: System modeling and phenomena discussion
  77. Novel Effa-Based Thin-Film RF-MEMS Technology
  78. Harmonic orthogonality condition in RF Class-E Power Amplifiers
  79. Efficient Link Architecture for On-Chip Serial links and Networks
  80. RF vector measurement test-bench for evaluation of behavioral model accuracy under realistic excitation
  81. Wideband Large-Signal RF Measurements Applied to Behavioral Model Extraction
  82. RF-MEMS technology platform for agile mobile and satellite communications
  83. Four-port Deembedding Technique for FET Devices Mounted in Hybrid Test Fixture
  84. Fast Modeling and Optimization of Active Millimeter Wave Imaging Systems
  85. Ar Implantation, a Passivation Technique for High-Resistivity Silicon within the MCM-D Technology
  86. Extraction of small-signal equivalent circuit model parameters for Si/SiGe HBT using S-parameters measurements and one geometrical information
  87. Wafer-level package interconnect options
  88. Accurate Large-Signal Time-Domain Behavioral Model for Multi-Signal Analysis
  89. Characterization of speckle/despeckling in active millimeter wave imaging systems using a first order 1.5D model
  90. A surface micromachined electrostatically tunable film bulk acoustic resonator
  91. TRANSISTOR LEVEL MODELING FOR ANALOG/RF IC DESIGN
  92. A Measurement-Based Multisine Design Procedure
  93. Large-signal behavioural modelling - from transistor to amplifier
  94. Filter-through device: a distributed RF-MEMS capacitive series switch
  95. Compact and high-accuracy RF MEMS capacitive series devices
  96. Package level interconnect options
  97. Constitutive relations for nonlinear modeling of Si/SiGe HBTs using an ANN model
  98. RF-power: driver for electrostatic RF-MEMS devices
  99. A surface micromachined tunable film bulk acoustic resonator
  100. A physics-based VLSI interconnect model including substrate and conductor skin effects
  101. Accurate RF Electrical Characterization of CSPs Using MCM-D Thin Film Technology
  102. Detecting variations of small-signal equivalent-circuit model parameters in the Si/SiGe HBT process with ANN
  103. New modeling approach of on‐chip interconnects for RF integrated circuits in CMOS technology
  104. The influence of packaging materials on RF performance
  105. Modeling and characterization of the polymer stud grid array (PSGA) package: electrical, thermal and thermo-mechanical qualification
  106. Guest Editorial
  107. S-parameter reciprocity relations, normalization, and thru-line-reflect error box completion
  108. Electrical characterisation of BGA package for RF applications
  109. On the frequency-dependent line admittance of VLSI interconnect lines on silicon-based semiconductor substrates
  110. Frequency-dependent expressions for inductance and resistance of microstrip line on silicon substrate
  111. On the frequency‐dependent line capacitance and conductance of on‐chip interconnects on lossy silicon substrate
  112. Add-on Cu/SiLK/sup TM/ module for high Q inductors
  113. Frequency-dependent closed-form expressions for inductance and resistance of a single interconnect on a silicon substrate
  114. Some measurement results for frequency-dependent inductance of IC interconnects on a lossy silicon substrate
  115. A CAD-oriented analytical model for frequency-dependent series resistance and inductance of microstrip on-chip interconnect on silicon substrate
  116. Physics-based closed-form inductance expression for compact modeling of integrated spiral inductors
  117. Highly accurate closed form approximation for frequency-dependent line impedance of a lossy silicon substrate IC interconnect
  118. Accurate analytic expressions for frequency-dependent inductance and resistance of single on-chip interconnects on conductive silicon substrate
  119. Frequency-dependent mutual resistance and inductance formulas for coupled IC interconnects on an Si-SiO2 substrate
  120. Simple and accurate expressions for distributed mutual inductance and resistance of semiconducting interconnects
  121. New closed-form formula for frequency-dependent resistance and inductance of IC interconnects on silicon substrate
  122. On the modelling of multiconductor multilayer systems for interconnect applications
  123. New approach for calculation of line parameters of IC interconnects
  124. On the mutual capacitance and inductance of a shielded interconnect four-line system
  125. Simulations and measurements of capacitance in dielectric stacks and consequences for integration
  126. Fast and accurate analysis of the multiconductor interconnects
  127. The influence of the bumping height on the performance of flip-chipped CPW Lange couplers
  128. On the capacitance and conductance calculations of integrated-circuit interconnects with thick conductors
  129. Novel approach for a design-oriented measurement-based fully scalable coplanar waveguide transmission line model
  130. Multilayer thin-film MCM-D for the integration of high-performance RF and microwave circuits
  131. Integration of CPW quadrature couplers in multilayer thin-film MCM-D
  132. Distributed inductance and resistance per-unit-length formulas for VLSI interconnects on silicon substrate
  133. Characteristic impedance extraction using calibration comparison
  134. Accurate transmission line characterisation on high and low-resistivity substrates
  135. A direct Ku-band linear subharmonically pumped BPSK and I/Q vector modulator in multilayer thin-film MCM-D
  136. Computation of capacitance matrix for integrated circuit interconnects using semi-analytic Green's function method
  137. A new approach for the calculation of line capacitances of two-layer IC interconnects
  138. HEMT parameter extraction combining optimization and direct parasitic extraction
  139. Development of a frequency-domain simulation tool and nonlinear device model from vectorial large-signal measurements
  140. Characterising differences between measurement and calibration wafer in probe-tip calibrations
  141. Frequency-Domain Simulation Tool Dedicated for Frequency-Domain Based Non-Linear Models
  142. Two new measurement methods for explicit determination of complex permittivity
  143. A simple error correction method for two-port transmission parameter measurement
  144. Improved HEMT model for low phase-noise InP-based MMIC oscillators
  145. A new technique for in-fixture calibration using standards of constant length
  146. Complex permittivity measurement method based on asymmetry of reciprocal two-ports
  147. Consistent small-signal and large-signal extraction techniques for heterojunction FET's
  148. Broadband active microstrip antenna design with the simplified real frequency technique
  149. Current antenna research at K. U. Leuven
  150. Integrals for the mutual coupling between dipoles or between slots: with or without complex conjugate?
  151. High-resistivity silicon surface passivation for the thin-film MCM-D technology
  152. 60 GHz Si micromachined cavity resonator on MCM-D
  153. Integration of silicon etched waveguides with MCM-D for V- and W-band
  154. Integration of high-Q resonators with MCM-D for millimeter wave applications
  155. Design and fabrication of a surface micromachined frequency tunable film bulk acoustic resonator with an extended electrostatic tuning range
  156. Accurate broadband parameter extraction methodology for s-parameter measurements