All Stories

  1. A General Line–Line Method for Dielectric Material Characterization Using Conductors With the Same Cross-Sectional Geometry
  2. A Planar One-Port Microwave Microfluidic Sensor for Microliter Liquids Characterization
  3. A Multiline Multimaterial Calibration Method for Liquid Characterization
  4. Circuit modelling of printed circuit boards for a DC-DC converter design
  5. Simple and Scalable Methodology for Equivalent Circuit Modeling of IC Packages
  6. Efficient Dithering Technique With Periodic Waveforms for RF Test and Characterization
  7. EuMW Special Issue
  8. A smart wearable textile array system for biomedical telemetry applications
  9. Optimization of an RFID loop antenna with smart goal functions
  10. A system-level simulator for indoor mmW SAR imaging and its applications
  11. Characterizing the TEM Cell Electric and Magnetic Field Coupling to PCB Transmission Lines
  12. Waveforms-based large-signal identification of transistor models
  13. Nonlinear deembedding of microwave large-signal measurements
  14. A novel indoor localization system for healthcare environments
  15. Octave-bandwidth band-pass filter with high selectivity and wide highly-suppressed stopband
  16. Possible improvements of exisiting indoor MMW focal plane imaging systems
  17. Waveforms-Only Based Nonlinear De-Embedding in Active Devices
  18. Slot coupled patch antenna in MCM-D for millimeter wave detector matrix applications
  19. Mutual Coupling Reduction Between Planar Antennas by Using a Simple Microstrip U-Section
  20. Fully micromachined W-band rectangular waveguide to grounded coplanar waveguide transition
  21. 60 GHz low noise amplifiers with 1 kV CDM protection in 40 nm LP CMOS
  22. Influence of antenna's directivity in indoor mmW/THz SAR imaging systems: A system level simulation-based study
  23. Design and reliability evaluation of passive HF RFID systems in metal environments
  24. Analysis of the Realistic Resolution with Angle of Arrival for Indoor Positioning
  25. Circuits and systems engineering education through interdisciplinary team-based design projects
  26. A low-cost linear upconverter to extend frequency range of vector signal generator
  27. Waveguide tuner stabilized ultra low phase noise 60 GHz SiGe:C oscillator MMIC
  28. Identification technique of FET model based on vector nonlinear measurements
  29. A de-embedding procedure oriented to the determination of FET intrinsic I-V characteristics from high-frequency large-signal measurements
  30. Vector two-tone measurements for validation of non-linear microwave FinFET model
  31. Impact of sampling domain and number of samples on the accuracy of large-signal multisine measurement-based behavioral model
  32. A wideband beamformer for a phased-array 60GHz receiver in 40nm digital CMOS
  33. Time of Arrival Based on Chirp Pulses as a means to Perform Localization in IEEE 802.15.4a Wireless Sensor Networks
  34. Simple and accurate approaches to implement the complex trans-conductance suited for time-domain simulators for small-signal and large-signal table-based models
  35. Experimental investigation of LF dispersion and IMD asymmetry within GaN based HEMT technology
  36. Evaluation of lookup-table non-quasi-static nonlinear models at microwave and mm-wave frequencies
  37. Millimeter wave imaging system modeling: spatial frequency domain calculation versus spatial domain calculation
  38. Technology-Independent Non-Quasi-Static Table-Based Nonlinear Model Generation
  39. Low-Cost CMOS-Based Receive Modules for 60 GHz Wireless Communication
  40. Millimeter wave micromachined cavity resonators on MCM-D: Oscillator-resonator co-design and packaging considerations
  41. Detailed analysis of parasitic loading effects on power performance of GaN-on-silicon HEMTs
  42. 50-to-67GHz ESD-protected power amplifiers in digital 45nm LP CMOS
  43. Influence of Different Types of Metal Plates on a High Frequency RFID Loop Antenna: Study and Design
  44. Three-stage Doherty amplifier for WiMAX application
  45. Simultaneous measurement of high and low frequency response of non-linear microwave circuits
  46. Inexpensive solution to double RF bandwidth of vector signal generator
  47. Horizontal Integration of Cavity Filters on High-Resistivity Silicon Thin-Film Technology
  48. WiMAX class AB and class E power amplifier design using equivalent capacitance concept
  49. Wide-band hybrid power amplifier design using GaN FETs
  50. Non-quasi-static nonlinear model for FinFETs using higher-order sources
  51. Complete characterisation of LF and RF dynamics at device terminals within microwave circuits
  52. Efficiency Enhancement of Harmonic-Tuned GaN Power Amplifier Using Doherty like Load Modulation
  53. Doherty amplifier design for 3.5 GHz WiMAX considering load line and loop stability
  54. 60 GHz ultra low phase noise sige common base oscillator using a wirebond coupled mcm integrated micromachined cavity resonator
  55. Black box modelling of the Op-Amp including switching power supply on effect
  56. Comparison of optical and millimeter wave imaging on speckle
  57. Thin-film MCM-D technology with through-substrate vias for the integration of 3D SiP modules
  58. RF Class-E Power Amplifier Design Based on a Load Line-Equivalent Capacitance Method
  59. Study of active millimeter-wave image speckle reduction by Hadamard phase pattern illumination
  60. Ultra-Miniaturized Integrated Cavities on High-Resistivity Silicon Thin-Film MCM-D Technology
  61. A Robust Semantic Overlay Network for Microgrid Control Applications
  62. System modelling for millimeter-wave imaging systems using a 2.5D calculation method
  63. Microstrip thin-film MCM-D technology on high-resistivity silicon with integrated through-substrate vias
  64. GaN power amplifier design based on artificial neural network modelling
  65. Analytical Model of the DC Actuation of Electrostatic MEMS Devices With Distributed Dielectric Charging and Nonplanar Electrodes
  66. An electrostatic fringing-field actuator (EFFA): application towards a low-complexity thin-film RF-MEMS technology
  67. Millimeter wave imaging: System modeling and phenomena discussion
  68. Novel Effa-Based Thin-Film RF-MEMS Technology
  69. Harmonic orthogonality condition in RF Class-E Power Amplifiers
  70. Efficient Link Architecture for On-Chip Serial links and Networks
  71. Wideband Large-Signal RF Measurements Applied to Behavioral Model Extraction
  72. RF-MEMS technology platform for agile mobile and satellite communications
  73. Four-port Deembedding Technique for FET Devices Mounted in Hybrid Test Fixture
  74. Fast Modeling and Optimization of Active Millimeter Wave Imaging Systems
  75. Ar Implantation, a Passivation Technique for High-Resistivity Silicon within the MCM-D Technology
  76. Extraction of small-signal equivalent circuit model parameters for Si/SiGe HBT using S-parameters measurements and one geometrical information
  77. Wafer-level package interconnect options
  78. Accurate Large-Signal Time-Domain Behavioral Model for Multi-Signal Analysis
  79. Characterization of speckle/despeckling in active millimeter wave imaging systems using a first order 1.5D model
  80. A surface micromachined electrostatically tunable film bulk acoustic resonator
  81. TRANSISTOR LEVEL MODELING FOR ANALOG/RF IC DESIGN
  82. A Measurement-Based Multisine Design Procedure
  83. Large-signal behavioural modelling - from transistor to amplifier
  84. Filter-through device: a distributed RF-MEMS capacitive series switch
  85. Compact and high-accuracy RF MEMS capacitive series devices
  86. Package level interconnect options
  87. Constitutive relations for nonlinear modeling of Si/SiGe HBTs using an ANN model
  88. RF-power: driver for electrostatic RF-MEMS devices
  89. A surface micromachined tunable film bulk acoustic resonator
  90. A physics-based VLSI interconnect model including substrate and conductor skin effects
  91. Accurate RF Electrical Characterization of CSPs Using MCM-D Thin Film Technology
  92. Detecting variations of small-signal equivalent-circuit model parameters in the Si/SiGe HBT process with ANN
  93. New modeling approach of on‐chip interconnects for RF integrated circuits in CMOS technology
  94. The influence of packaging materials on RF performance
  95. Modeling and characterization of the polymer stud grid array (PSGA) package: electrical, thermal and thermo-mechanical qualification
  96. Guest Editorial
  97. S-parameter reciprocity relations, normalization, and thru-line-reflect error box completion
  98. Electrical characterisation of BGA package for RF applications
  99. On the frequency-dependent line admittance of VLSI interconnect lines on silicon-based semiconductor substrates
  100. Frequency-dependent expressions for inductance and resistance of microstrip line on silicon substrate
  101. On the frequency‐dependent line capacitance and conductance of on‐chip interconnects on lossy silicon substrate
  102. Add-on Cu/SiLK/sup TM/ module for high Q inductors
  103. Frequency-dependent closed-form expressions for inductance and resistance of a single interconnect on a silicon substrate
  104. Some measurement results for frequency-dependent inductance of IC interconnects on a lossy silicon substrate
  105. A CAD-oriented analytical model for frequency-dependent series resistance and inductance of microstrip on-chip interconnect on silicon substrate
  106. Physics-based closed-form inductance expression for compact modeling of integrated spiral inductors
  107. Highly accurate closed form approximation for frequency-dependent line impedance of a lossy silicon substrate IC interconnect
  108. Accurate analytic expressions for frequency-dependent inductance and resistance of single on-chip interconnects on conductive silicon substrate
  109. Frequency-dependent mutual resistance and inductance formulas for coupled IC interconnects on an Si-SiO2 substrate
  110. Simple and accurate expressions for distributed mutual inductance and resistance of semiconducting interconnects
  111. New closed-form formula for frequency-dependent resistance and inductance of IC interconnects on silicon substrate
  112. On the modelling of multiconductor multilayer systems for interconnect applications
  113. New approach for calculation of line parameters of IC interconnects
  114. On the mutual capacitance and inductance of a shielded interconnect four-line system
  115. Simulations and measurements of capacitance in dielectric stacks and consequences for integration
  116. Fast and accurate analysis of the multiconductor interconnects
  117. The influence of the bumping height on the performance of flip-chipped CPW Lange couplers
  118. On the capacitance and conductance calculations of integrated-circuit interconnects with thick conductors
  119. Novel approach for a design-oriented measurement-based fully scalable coplanar waveguide transmission line model
  120. Multilayer thin-film MCM-D for the integration of high-performance RF and microwave circuits
  121. Integration of CPW quadrature couplers in multilayer thin-film MCM-D
  122. Distributed inductance and resistance per-unit-length formulas for VLSI interconnects on silicon substrate
  123. Characteristic impedance extraction using calibration comparison
  124. Accurate transmission line characterisation on high and low-resistivity substrates
  125. A direct Ku-band linear subharmonically pumped BPSK and I/Q vector modulator in multilayer thin-film MCM-D
  126. Computation of capacitance matrix for integrated circuit interconnects using semi-analytic Green's function method
  127. A new approach for the calculation of line capacitances of two-layer IC interconnects
  128. HEMT parameter extraction combining optimization and direct parasitic extraction
  129. Development of a frequency-domain simulation tool and nonlinear device model from vectorial large-signal measurements
  130. Characterising differences between measurement and calibration wafer in probe-tip calibrations
  131. Frequency-Domain Simulation Tool Dedicated for Frequency-Domain Based Non-Linear Models
  132. Two new measurement methods for explicit determination of complex permittivity
  133. A simple error correction method for two-port transmission parameter measurement
  134. Improved HEMT model for low phase-noise InP-based MMIC oscillators
  135. A new technique for in-fixture calibration using standards of constant length
  136. Complex permittivity measurement method based on asymmetry of reciprocal two-ports
  137. Consistent small-signal and large-signal extraction techniques for heterojunction FET's
  138. Broadband active microstrip antenna design with the simplified real frequency technique
  139. Current antenna research at K. U. Leuven
  140. Integrals for the mutual coupling between dipoles or between slots: with or without complex conjugate?
  141. High-resistivity silicon surface passivation for the thin-film MCM-D technology
  142. 60 GHz Si micromachined cavity resonator on MCM-D
  143. Integration of silicon etched waveguides with MCM-D for V- and W-band
  144. Integration of high-Q resonators with MCM-D for millimeter wave applications
  145. Design and fabrication of a surface micromachined frequency tunable film bulk acoustic resonator with an extended electrostatic tuning range
  146. Accurate broadband parameter extraction methodology for s-parameter measurements