All Stories

  1. Benzene bridged hybrid organosilicate films with improved stiffness and small pore size

    Article • Materials Chemistry and Physics, October 2022, Elsevier

    Askar Rezvanov

  2. Modification of Porous Ultralow-k Film by Vacuum Ultraviolet Emission

    Article • ACS Applied Electronic Materials, June 2022, American Chemical Society (ACS)

    Askar Rezvanov

  3. Atomic layer deposition of thin films of hafnium oxide using Izofaz TM 200-01 system

    Article • January 2022, SPIE

    Askar Rezvanov

  4. Investigation of conductive filament growth and rupture in ReRAM structures based on hafnium oxide

    Article • January 2022, SPIE

    Askar Rezvanov

  5. Methylated porous low-k materials: critical properties and plasma resistance

    Article • January 2022, SPIE

    Askar Rezvanov

  6. Mechanical Properties of Low-k Dielectric Deposited on Subtractively Patterned Cu Lines for Advanced Interconnects

    Article • July 2021, Institute of Electrical & Electronics Engineers (IEEE)

    Askar Rezvanov

  7. Evaluation of Mechanical Properties of Porous OSG Films by PFQNM AFM and Benchmarking with Traditional Instrumentation

    Article • Langmuir, July 2020, American Chemical Society (ACS)

    Askar Rezvanov

  8. Effect of terminal methyl group concentration on critical properties and plasma resistance of organosilicate low-k dielectrics

    Article • Journal of Vacuum Science & Technology A Vacuum Surfaces and Films, March 2020, American Vacuum Society

    Askar Rezvanov

  9. Use of a Thermally Degradable Chemical Vapor Deposited Polymer Film for Low Damage Plasma Processing of Highly Porous Dielectrics

    Article • ACS Applied Electronic Materials, November 2019, American Chemical Society (ACS)

    Askar Rezvanov

  10. Area selective grafting of siloxane molecules on low-k dielectric with respect to copper surface

    Article • Applied Surface Science, May 2019, Elsevier

    Askar Rezvanov

  11. Gas Phase Pore Stuffing for the protection of organo-silicate glass dielectric materials

    Article • December 2018, Institute of Electrical & Electronics Engineers (IEEE)

    Askar Rezvanov

  12. Modeling the Dynamics of the Integral Dielectric Permittivity of a Porous Low-K Organosilicate Film during the Dry Etching of a Photoresist in O2 Plasma

    Article • Russian Microelectronics, November 2018, Pleiades Publishing Ltd

    Askar Rezvanov

  13. Low-k protection from F radicals and VUV photons using a multilayer pore grafting approach

    Article • Journal of Physics D Applied Physics, July 2018, Institute of Physics Publishing

    Askar Rezvanov

  14. Pore surface grafting of porous low-k dielectrics by selective polymers

    Article • Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena, March 2017, American Vacuum Society

    Askar Rezvanov

  15. Cryogenic etching of porous low-k dielectrics in CF3Br and CF4 plasmas

    Article • Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena, March 2017, American Vacuum Society

    Askar Rezvanov

  16. Cellular-automata model of oxygen plasma impact on porous low-K dielectric

    Article • December 2016, SPIE

    Askar Rezvanov