All Stories

  1. Effect of mechanochemical milling on the properties of Ag₂O self-reducing pastes for conductive layers in flexible electronics
  2. Durability of New Developed PCB Surface Finishes to Multiple Reflow
  3. Long-Term Stability Analysis of the Paper-Based Nomex 410 Substrate's Dielectric Properties
  4. Possibilities of Using Polyethylene Carbon Material AF-1361 for Sensor Applications
  5. Effect of New Types of PCB Surface Finishes on Fractographic Morphology of Solder Joints
  6. Stability of OhmegaPly Resistors with Different Shapes
  7. The Effect of Ge Doping on α-Ag2S’s Thermoelectric and Mechanical Properties
  8. Effect of non-standard SnAg surface finishes on properties of solder joints
  9. Comparative Study on the Effect of Surface Finish on Mechanical Properties of Solder Joints
  10. Analysis of the Possibilities of Creating Embedded Vias’ Based on Different Solder Alloys
  11. Graphene-Based UWB Antenna on the Polyimide Substrate
  12. Moisture Absorption of Glass-Epoxy Sandwich Structure
  13. Real-time contact angle’s measurement of molten solder balls in laboratory conditions
  14. Thick Layers’ Adhesion Measurements on Flexible Substrate by Cross Cut Adhesion Test
  15. Wetting of New SnAg Surface Finish
  16. Inkjet-printed HF antenna made on PET substrate
  17. Influence of Various Technologies on the Quality of Ultra-Wideband Antenna on a Polymeric Substrate
  18. Reliability of Embedded SMD Resistors Realized by Face–down Technology
  19. Mechanical properties of sandwich electronic boards after multi reflow exposure
  20. A MEMS Accelerometer Utilization for Viscosity of Technical Oils Sensing
  21. Capacitive Sensors for Saturated Vapour Height Sensing in VPS Soldering
  22. Embedding of Passive SMD Components into the Microvia
  23. Whisker Development from SAC0307-Mn07 Solder Alloy
  24. Properties of glass/epoxy sandwich structure for electronic boards
  25. Measurement and regulation of saturated vapour height level in VPS chamber
  26. Coplanar Capacitive Liquid Level Sensor
  27. Design of Microstrip Antennas for 2.45 GHz on Different Substrates
  28. Dielectric Properties of Substrates for InkJet Technology in GHz Area
  29. Joints realized by sintering of pressureless Ag paste
  30. Investigation of inkjet printed path resistance in the context of manufacture and flexible application
  31. Development and Characterisation of New Biocompatible Sn-Mg Lead-Free Solder
  32. Viscosity Measurement of Silver Based Nano-inks
  33. Improvement of the evaluation of inkjet printed silver based layers’ adhesion
  34. Pressureless Silver Sintering in Power Application
  35. Capacitive touch sensor
  36. Dielectric properties' homogeneity of various substrates in GHz area
  37. Stability of miniaturized non-trimmed thick- and thin-film resistors
  38. Viscosity of Silver Based Nano-Inks
  39. Millimeter-wave Dielectric Resonator Antenna Array Based on Directive LTCC Elements
  40. Influence of various micro channels integrated in LTCC multilayer module on the thermal resistance
  41. Influence of firing profile on microstructural and dielectric properties of LTCC substrates
  42. Dependence of electrical resistivity on sintering conditions of silver layers printed by InkJet printing technology
  43. Design and realisation of planar capacitive proximity sensor based on LTCC using simulation software
  44. Improving thermal resistance of multilayer LTCC module with cooling channels and thermal vias
  45. Possibility of PCBs' miniaturization by using thick film polymer resistors
  46. Investigation of nano-inks’ behaviour on flexible and rigid substrates under various conditions
  47. Real-time profiling of reflow process in VPS chamber
  48. Structure and thermal behavior of lead-free solders prepared by rapid solidification of their melt
  49. Simulation of cooling efficiency via miniaturised channels in multilayer LTCC for power electronics
  50. Millimeter-wave directive dielectric resonator antenna based on LTCC
  51. LTCC Based Planar Inductive Proximity Sensor Design
  52. Nano-ink Drops’ Behavior on the Polymeric Substrates’ Surfaces
  53. Study of die attachment on DBC substrate
  54. A new approach to construction of extended kit for M-Sequence UWB sensor system based on LTCC
  55. Influence of various multilayer LTCC systems on dielectric properties’ stability in GHz frequency range
  56. Development of planar inductive sensor for proximity sensing based on LTCC
  57. Image processing of die attach's X-ray images for automatic voids detection and evaluation
  58. Influence of accelerating ageing on LTCC and PCB substrates' dielectric properties in GHz area
  59. The impact of surface properties of polymeric substrates on the nano-behavior
  60. Surface analysis of polymeric substrates used for inkjet printing technology
  61. Impact analysis of LTCC materials on microstrip filters’ behaviour up to 13 GHz
  62. Influence of current and combined thermo-current load on microstructure and resistance of solder joints
  63. Measuring of dielectric properties by microstrip resonators in the GHz frequency
  64. Microstrip methods for measurement of dielectric properties in High Frequency area
  65. Modified I - Q Demodulator for m-sequence UWB sensor system based on LTCC
  66. Possibilities of motor oil continuous diagnostics
  67. UWB antenna based on nanoparticles of silver on polyimide substrate
  68. Usability of Various LTCC in Microstrip Filters Construction
  69. Atomic structure of Cu–Zr–Ti metallic glasses subjected to high temperature annealing
  70. Analysis of mechanical properties of LTCC substrates
  71. Influence of different methods of ageing on microstructure of solder joints
  72. Integration of microstrip LP and BP filters to multilayer structure based on various LTCC
  73. Stability of LTCC substrates in high frequency area after accelerated aging tests
  74. Design of microstrip band pass filter based on LTCC for UWB sensor system
  75. Design of narrow-band 2.4 – 2.5 GHz notch filter using various materials
  76. Design of low pass filter for UWB application
  77. Investigation of rheology behavior of solder paste
  78. Reliability testing of lead-free solder joints
  79. Boundary value of rheological properties of solder paste
  80. Perspectives of CAD education at the department of technologies in electronics
  81. Phase evolution of solder alloys
  82. In situ investigation of SnAgCu solder alloy microstructure
  83. Encased manipulation chamber for technologic laboratory
  84. Infrared analysis of temperature distribution on the surface of a populated PCB
  85. Principle of X–ray investigation of solder alloy
  86. HISOLD 4P Q&R, COST project for solder material innovations and solder joint properties assessment
  87. VPS and reliability of solder joint
  88. Analysis of intermetallic compounds in lead-free solders
  89. Vocational training and further education in electronic technology as feasible TQM tool
  90. Electrically conductive adhesive filled with mixture of silver nano and microparticles
  91. Testing of techniques for improvement of conductivity of electrically conductive adhesives
  92. Influence of production technology to reliability of interconnections in the LTCC modules
  93. Microstructure analysis and measurement of nonlinearity of vapour phase reflowed solder joints
  94. Modification of electrically conductive adhesives for better mechanical and electrical properties
  95. Monitoring of the temperature profile of vapour phase reflow soldering
  96. Microstructural Analysis and Transport Properties of RuO2-Based Thick Film Resistors
  97. Optimization of Testing Methods for Investigation of Joints Quality Based on Vapour Phase Lead-free Soldering
  98. Micro-Modular Training System in Electronic Technology - Alternative TQM Tool
  99. Optimisation of Lead Free Solders Reflow Profile
  100. Utilization of Anisotropic Adhesive Joints as an Alternative to Standard SnPb Solder Joints
  101. Electromagnetic Behavior of Inductive Planar Structures with Non-Homogenous Magnetic Environment
  102. RuO2-based Low Temperature Sensors with ?Tuned? Resistivity Dependencies
  103. Bent multilayer LTCC modules for sensor applications
  104. Low temperature micro-calorimeters based on thick film resistors
  105. Thermal shock reliability tests of multilayer LTCC modules with thick film conductors
  106. Stability and reliability of thick film resistors constructed by different techniques
  107. Chosen electrical and reliability properties of thick film photoimageable components
  108. Capacitive button for application in higher humidity environment [position sensors]
  109. Properties and utilization of 3D bent-multilayer hybrid structures
  110. Potentiality of LTCC for sensor applications