All Stories

  1. Effect of Mechanochemical Modification of Ag2O Particles on the Electrical Properties of Ag Layers Formed from Ag2O Pastes
  2. Investigation of the Solder Fluxes Activity by Measuring of the Contact Angle
  3. Simulation of Temperature Distribution in Large-Area Joints in Power Electronics
  4. Effect of mechanochemical milling on the properties of Ag₂O self-reducing pastes for conductive layers in flexible electronics
  5. Durability of New Developed PCB Surface Finishes to Multiple Reflow
  6. Long-Term Stability Analysis of the Paper-Based Nomex 410 Substrate's Dielectric Properties
  7. Possibilities of Using Polyethylene Carbon Material AF-1361 for Sensor Applications
  8. Effect of New Types of PCB Surface Finishes on Fractographic Morphology of Solder Joints
  9. Stability of OhmegaPly Resistors with Different Shapes
  10. The Effect of Ge Doping on α-Ag2S’s Thermoelectric and Mechanical Properties
  11. Effect of non-standard SnAg surface finishes on properties of solder joints
  12. Comparative Study on the Effect of Surface Finish on Mechanical Properties of Solder Joints
  13. Analysis of the Possibilities of Creating Embedded Vias’ Based on Different Solder Alloys
  14. Graphene-Based UWB Antenna on the Polyimide Substrate
  15. Moisture Absorption of Glass-Epoxy Sandwich Structure
  16. Real-time contact angle’s measurement of molten solder balls in laboratory conditions
  17. Thick Layers’ Adhesion Measurements on Flexible Substrate by Cross Cut Adhesion Test
  18. Wetting of New SnAg Surface Finish
  19. Inkjet-printed HF antenna made on PET substrate
  20. Influence of Various Technologies on the Quality of Ultra-Wideband Antenna on a Polymeric Substrate
  21. Reliability of Embedded SMD Resistors Realized by Face–down Technology
  22. Mechanical properties of sandwich electronic boards after multi reflow exposure
  23. A MEMS Accelerometer Utilization for Viscosity of Technical Oils Sensing
  24. Capacitive Sensors for Saturated Vapour Height Sensing in VPS Soldering
  25. Embedding of Passive SMD Components into the Microvia
  26. Whisker Development from SAC0307-Mn07 Solder Alloy
  27. Properties of glass/epoxy sandwich structure for electronic boards
  28. Measurement and regulation of saturated vapour height level in VPS chamber
  29. Coplanar Capacitive Liquid Level Sensor
  30. Design of Microstrip Antennas for 2.45 GHz on Different Substrates
  31. Dielectric Properties of Substrates for InkJet Technology in GHz Area
  32. Joints realized by sintering of pressureless Ag paste
  33. Investigation of inkjet printed path resistance in the context of manufacture and flexible application
  34. Development and Characterisation of New Biocompatible Sn-Mg Lead-Free Solder
  35. Viscosity Measurement of Silver Based Nano-inks
  36. Improvement of the evaluation of inkjet printed silver based layers’ adhesion
  37. Pressureless Silver Sintering in Power Application
  38. Capacitive touch sensor
  39. Dielectric properties' homogeneity of various substrates in GHz area
  40. Stability of miniaturized non-trimmed thick- and thin-film resistors
  41. Viscosity of Silver Based Nano-Inks
  42. Millimeter-wave Dielectric Resonator Antenna Array Based on Directive LTCC Elements
  43. Influence of various micro channels integrated in LTCC multilayer module on the thermal resistance
  44. Influence of firing profile on microstructural and dielectric properties of LTCC substrates
  45. Dependence of electrical resistivity on sintering conditions of silver layers printed by InkJet printing technology
  46. Design and realisation of planar capacitive proximity sensor based on LTCC using simulation software
  47. Improving thermal resistance of multilayer LTCC module with cooling channels and thermal vias
  48. Possibility of PCBs' miniaturization by using thick film polymer resistors
  49. Investigation of nano-inks’ behaviour on flexible and rigid substrates under various conditions
  50. Real-time profiling of reflow process in VPS chamber
  51. Structure and thermal behavior of lead-free solders prepared by rapid solidification of their melt
  52. Simulation of cooling efficiency via miniaturised channels in multilayer LTCC for power electronics
  53. Millimeter-wave directive dielectric resonator antenna based on LTCC
  54. LTCC Based Planar Inductive Proximity Sensor Design
  55. Nano-ink Drops’ Behavior on the Polymeric Substrates’ Surfaces
  56. Study of die attachment on DBC substrate
  57. A new approach to construction of extended kit for M-Sequence UWB sensor system based on LTCC
  58. Influence of various multilayer LTCC systems on dielectric properties’ stability in GHz frequency range
  59. Development of planar inductive sensor for proximity sensing based on LTCC
  60. Image processing of die attach's X-ray images for automatic voids detection and evaluation
  61. Influence of accelerating ageing on LTCC and PCB substrates' dielectric properties in GHz area
  62. The impact of surface properties of polymeric substrates on the nano-behavior
  63. Surface analysis of polymeric substrates used for inkjet printing technology
  64. Impact analysis of LTCC materials on microstrip filters’ behaviour up to 13 GHz
  65. Influence of current and combined thermo-current load on microstructure and resistance of solder joints
  66. Measuring of dielectric properties by microstrip resonators in the GHz frequency
  67. Microstrip methods for measurement of dielectric properties in High Frequency area
  68. Modified I - Q Demodulator for m-sequence UWB sensor system based on LTCC
  69. Possibilities of motor oil continuous diagnostics
  70. UWB antenna based on nanoparticles of silver on polyimide substrate
  71. Usability of Various LTCC in Microstrip Filters Construction
  72. Atomic structure of Cu–Zr–Ti metallic glasses subjected to high temperature annealing
  73. Analysis of mechanical properties of LTCC substrates
  74. Influence of different methods of ageing on microstructure of solder joints
  75. Integration of microstrip LP and BP filters to multilayer structure based on various LTCC
  76. Stability of LTCC substrates in high frequency area after accelerated aging tests
  77. Design of microstrip band pass filter based on LTCC for UWB sensor system
  78. Design of narrow-band 2.4 – 2.5 GHz notch filter using various materials
  79. Design of low pass filter for UWB application
  80. Investigation of rheology behavior of solder paste
  81. Reliability testing of lead-free solder joints
  82. Boundary value of rheological properties of solder paste
  83. Perspectives of CAD education at the department of technologies in electronics
  84. Phase evolution of solder alloys
  85. In situ investigation of SnAgCu solder alloy microstructure
  86. Encased manipulation chamber for technologic laboratory
  87. Infrared analysis of temperature distribution on the surface of a populated PCB
  88. Principle of X–ray investigation of solder alloy
  89. HISOLD 4P Q&R, COST project for solder material innovations and solder joint properties assessment
  90. VPS and reliability of solder joint
  91. Analysis of intermetallic compounds in lead-free solders
  92. Vocational training and further education in electronic technology as feasible TQM tool
  93. Electrically conductive adhesive filled with mixture of silver nano and microparticles
  94. Testing of techniques for improvement of conductivity of electrically conductive adhesives
  95. Influence of production technology to reliability of interconnections in the LTCC modules
  96. Microstructure analysis and measurement of nonlinearity of vapour phase reflowed solder joints
  97. Modification of electrically conductive adhesives for better mechanical and electrical properties
  98. Monitoring of the temperature profile of vapour phase reflow soldering
  99. Microstructural Analysis and Transport Properties of RuO2-Based Thick Film Resistors
  100. Optimization of Testing Methods for Investigation of Joints Quality Based on Vapour Phase Lead-free Soldering
  101. Micro-Modular Training System in Electronic Technology - Alternative TQM Tool
  102. Optimisation of Lead Free Solders Reflow Profile
  103. Utilization of Anisotropic Adhesive Joints as an Alternative to Standard SnPb Solder Joints
  104. Electromagnetic Behavior of Inductive Planar Structures with Non-Homogenous Magnetic Environment
  105. RuO2-based Low Temperature Sensors with ?Tuned? Resistivity Dependencies
  106. Bent multilayer LTCC modules for sensor applications
  107. Low temperature micro-calorimeters based on thick film resistors
  108. Thermal shock reliability tests of multilayer LTCC modules with thick film conductors
  109. Stability and reliability of thick film resistors constructed by different techniques
  110. Chosen electrical and reliability properties of thick film photoimageable components
  111. Capacitive button for application in higher humidity environment [position sensors]
  112. Properties and utilization of 3D bent-multilayer hybrid structures
  113. Potentiality of LTCC for sensor applications