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  1. Effects of Relative Velocity on Grinding Performances under Si Wafer Rotary Grinding
  2. Effect of Cutting Speed on the Face Milling of CFRP Using a PCD Tool
  3. Face Turning of Cobalt-Free Tungsten Carbide Using Nano-Polycrystalline Diamond Tool
  4. Loop Stiffness of Grinding Machine Developed for 450 mm Silicon Wafers