All Stories

  1. Framework for SEM contour analysis

    Article • March 2017, SPIE

    Mr Loïc Schneider

  2. New placement estimator for contact hole printed with DSA

    Article • March 2016, SPIE

    Mr Loïc Schneider

  3. Enablement of DSA for VIA layer with a metal SIT process flow

    Article • March 2016, SPIE

    Mr Loïc Schneider

  4. OPC for curved designs in application to photonics on silicon

    Article • March 2016, SPIE

    Mr Loïc Schneider

  5. Skeleton-based OPC application for DSA full chip mask correction

    Article • September 2015, SPIE

    Mr Loïc Schneider

  6. Optical properties determination of Fully Depleted Silicon On Insulator (FDSOI) substrates by ellipsometry

    Article • May 2015, Institute of Electrical & Electronics Engineers (IEEE)

    Mr Loïc Schneider