All Stories

  1. Voltage Balancing of Series-Connected SiC mosfets With Adaptive-Impedance Self-Powered Gate Drivers
  2. Temperature distribution of 10 kV and 15 kV SiC-MOSFETs with large edge area
  3. A Phase Detection Method using Power Handling Capability in Resonant Converters
  4. Analysis of Miller Region Sustained Oscillations during Turn-on of High-Side 10kV SiC MOSFET
  5. Ceramic baseplate-less 10 kV SiC MOSFET power module with integrated liquid cooling
  6. Thermal cycling characterization of integrated GaN power module
  7. Modeling and Operation of Series-Parallel Resonant Load in Industrial RF Dielectric Heating Application
  8. Multi-cell Operation of Class-PN at 6.78 MHz using GaN Devices for Industrial Dielectric Heating
  9. Loss Imbalance in SiC Half-Bridge Power Module
  10. Auxiliary Power Supply Startup Evaluation and Improvement of the Input-series System with Small Submodule Capacitances
  11. Demonstration of a Class E push-pull resonant inverter for MHz induction heating
  12. Heat cycle failure point prediction by 3D thermal stress analysis for medium voltage power module
  13. Thermal Characteristics of Liquid Metal Interconnects for Power Semiconductors
  14. Integrating 10-kV SiC MOSFET Into Battery Energy Storage System With a Scalable Converter-Based Self-Powered Gate Driver
  15. Short-Circuit Characteristic of Single Gate Driven SiC MOSFET Stack and Its Improvement With Strong Antishort Circuit Fault Capabilities
  16. An LTSpice - MATLAB Interface for Mitigating Convergence Problems in Circuit Optimization with SPICE
  17. Digital design demonstration of 10kV SiC-MOSFET power module to improve wire-bonding layout for power cycle capabilities
  18. Four-switch Class-PN Power Amplifier for High Power Handling Capability in Wireless Power Transfer
  19. Parasitic Capacitance Modeling of Inductors Without Using the Floating Voltage Potential of Core
  20. An enhanced single gate driven voltage‐balanced SiC MOSFET stack topology suitable for high‐voltage low‐power applications
  21. Derivation, Design and Simulation of the Zeta converter
  22. Evaluation of in situ Thermomechanical Stress–Strain in Power Modules Using Laser Displacement Sensors
  23. Parasitic Capacitance Modeling of Copper-Foiled Medium-Voltage Filter Inductors Considering Fringe Electrical Field
  24. Physics-Based Modeling of Parasitic Capacitance in Medium-Voltage Filter Inductors
  25. Identification of the Terminal-to-Core Couplings in Filter Inductors by Using Double-Pulse-Test Setup
  26. Overview of Digital Design and Finite-Element Analysis in Modern Power Electronic Packaging
  27. Daisy Chain PN Cell for Multilevel Converter using GaN for High Power Density
  28. Behavioral Modeling of Ground Current in Filter Inductors of Medium-Voltage SiC-MOSFET-Based Converters
  29. Demonstration of a 10 kV SiC MOSFET based Medium Voltage Power Stack
  30. Impact of Power Module Parasitic Capacitances on Medium-Voltage SiC MOSFETs Switching Transients
  31. Analysis of Cascaded Silicon Carbide MOSFETs Using a Single Gate Driver for Medium Voltage Applications
  32. Loss Prediction of Medium Voltage Power Modules: Trade-offs between Accuracy and Complexity
  33. Thermal Characteristics and Simulation of an Integrated GaN eHEMT Power Module
  34. High Frequency Resonant Operation of an Integrated Medium Voltage SiC MOSFET Power Module
  35. Derivation, Design and Simulation of the Single-Ended Primary-Inductor Converter (SEPIC)
  36. A Fast-Switching Integrated Full-Bridge Power Module Based on GaN eHEMT Devices
  37. Common mode current mitigation for medium voltage half bridge SiC modules
  38. Gate driver with high common mode rejection and self turn-on mitigation for a 10 kV SiC MOSFET enabled MV converter
  39. Performance analysis of commercial MOSFET packages in Class E converter operating at 2.56 MHz
  40. Reduction of parasitic capacitance in 10 kV SiC MOSFET power modules using 3D FEM
  41. Switching current imbalance mitigation in power modules with parallel connected SiC MOSFETs
  42. Novel screening techniques for wind turbine power converters
  43. Test bench for thermal cycling of 10 kV silicon carbide power modules
  44. Packaging of Wide Bandgap Power Semiconductors using Simulation-based Design